Mediatek Dimensity 9300, a Taiwanese chipmaker, has traditionally played second fiddle to Qualcomm in the flagship chip market. However, with the release of its 5G Dimensity series, the company has been closing the gap. While Dimensity chips have been impressive on paper, they have failed to match the performance of Snapdragon chips in the market. Recently, reported that the upcoming Mediatek Dimensity 9300 will be using TSMC’s N4P process, which means the chip will not be utilizing the latest 3nm process.
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DIMENSITY 9300 OUTPUT
TSMC’s N4P process has demonstrated an 11% improvement in output compared to the original 5nm technology. When compared to the N4 process, the N4P process is 6% better, and it reduces process complexity while shortening the wafer cycle time by reducing mask count. TSMC claims that the N4P process technology supports the seamless transfer of 5nm process products. The upcoming MediaTek Dimensity 9300 CPU will utilize the N4P process and include super-large, large, and small cores. The super-large core, Cortex X4, is compatible with only 64-bit programs.
The performance core of MediaTek Dimensity 9200 supports 64-bit applications, indicating that both MediaTek and ARM have firm support for 64-bit technology. The shift towards 64-bit architecture is evident in the cancellation of 32-bit support for both the super-large and large cores.
Dimensity 9300 is anticipated to support mobile light pursuit, enabling mobile games to incorporate a more realistic “soft shadow” effect. This feature will more accurately reflect the impact of light source distance and intensity on shadows, resulting in more authentic and detailed changes. Furthermore, this technology can bring about more realistic “mirror reflection” effects through ray tracing, such as reflections in puddles and mirrors on walls.
DIMENSITY 9300 RUMOURS
The MediaTek Dimensity 9300 is a premium system-on-a-chip (SoC) designed for high-end 5G smartphones. It utilizes the TSMC N4P (4nm) process, which is expected to offer a significant output improvement compared to the Dimensity 9200. The Dimensity 9300 boasts an octa-core CPU, along with the latest IMG BXM-8-256 GPU. It also includes advanced Imagiq camera technology, powerful MiraVision video processing, and HyperEngine gaming enhancements. The chip is extremely power-efficient, ensuring prolonged battery life even for demanding users. The Dimensity 9300 is anticipated to compete with other high-end SoCs, including the Qualcomm Snapdragon 8 Gen 3, and is projected to be a strong competitor in terms of output.
The MediaTek Dimensity 9300 is set to be released in the second half of 2023, as reported by numerous sources. The chip is projected to debut in October of that year. It is anticipated to rival Qualcomm’s Snapdragon 8 Gen 3, although there is limited information about the chip currently available. Consequently, it is difficult to ascertain how it will stack up against the SD8 Gen3 at this time.
While there is currently limited information available about the MediaTek Dimensity 9300, it has been noted that its predecessor, the Dimensity 9200+, has already demonstrated significant advantages in GPU output compared to the Snapdragon 8 Gen 2. It is expected that both the SD8 Gen3 and Dimensity 9300 will employ the TSMC N4P node. However, it is important to note that only Apple’s Bionic A17 chip will be using the 3nm manufacturing process this year, leaving Android chip makers with the TSMC 4nm process.
FINAL WORDS
Currently, there is insufficient information available to make definitive statements about the MediaTek Dimensity 9300 SoC. Nevertheless, predicts a substantial improvement in the GPU component. Until more details are disclosed, we will need to remain hopeful. As mentioned earlier, Dimensity chips appear promising on paper, but their performance on the market is still lagging behind.
